ADV3003

Rev. 0 | Page 15 of 16

OUTLINE DIMENSIONS

1

40

10

11

31

30

21

20

4.25

4.10 SQ

3.95

TOP

VIEW

6.00

BSC SQ

PIN 1

INDICATOR

5.75

BSC SQ

12° MAX

0.30

0.23

0.18

0.20 REF

SEATING

PLANE

1.00

0.85

0.80

0.05 MAX

0.02 NOM

COPLANARITY

0.08

0.80 MAX

0.65 TYP

4.50

REF

0.50

0.40

0.30

0.50

BSC

PIN 1

INDICATOR

0.60 MAX

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOT TOM VIEW)

COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2

*THE ADV3003 HAS A CONDUCTIVE HEAT SLUG (ePAD) TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF

THE PACKAGE AND ELECTRICALLY CONNECTED TO AVEE. IT IS RECOMMENDED THAT NO PCB SIGNAL TRACES

OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE SLUG.

ATTACHING THE SLUG TO AN AVEE POWER PLANE REDUCES THE JUNCTION TEMPERATURE OF THE DEVICE WHICH

MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.

Figure 29. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

6 mm × 6 mm Body, Very Thin Quad

(CP-40-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature

Range

Package Description

Package

Option

Ordering

Quantity

ADV3003ACPZ1

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-40-1

490

ADV3003ACPZ-R71

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Reel 7

CP-40-1

1500

ADV3003-EVALZ1

Evaluation Board