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US65 bảng dữ liệu(PDF) 11 Page - Melexis Microelectronic Systems

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nhà sản xuất  MELEXIS [Melexis Microelectronic Systems]
Trang chủ  http://www.melexis.com
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US65 bảng dữ liệu(HTML) 11 Page - Melexis Microelectronic Systems

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US65 / US66
Two-Coil Low Noise Fan Driver
High Output Current
3901090209
Page 11 of 12
Preliminary Datasheet
Rev 006
Jan/07
16 DC Package Information (8-pin narrow SOIC)
1
2
3
4
5
6
7
8
1.27 BSC
0.41
+0.08
- 0.06
4.93
+0.05
- 0.13
h x 45°
0.25
+0.05
- 0.06
5°
+3
- 5
See DETAIL A
DETAIL A
Parting Line
Seating Plane
Notes:
1. Controlling dimensions in millimeters
2. The appearance of pin 1 is optional, round type on single
leadframe and rectangular type on matrix leadframe.
3. Formed leads shall be planar with respect to one another
within 0.0792 mm at seating plane.
4. Length of terminal for soldering to a substrate.
5. Package length and width are reference datums and do
not include mold flash or protrusions, but does include
mold mismatch and are measured at the mold parting
line.
Mold flash or protrusions shall not exceed 0.1524 mm at
end and 0.254 mm at window.
x. This part is compliant with JEDEC standard MS-012.
Marking:
Line 1 :
US65 (US66) - Name of the Device
Line 2 :
XXXXXX - Assembly lot number (6 digits)
Line 3 :
YYWW - Assembly date
YY = year
WW = calendar week
see note 2
Addition
see note 3
0.64
+0.25
- 0.23
see note 4
see note 5
1
2
3
4
5
6
7
8
1.57
Package line
Notes:
1. All dimensions are in millimeters
Hall plate location



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