5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

VDD

–0.3

6

V

Control pins

ADDR, ID, DIR, INT_N/OUT3, EN_N

–0.3

VDD + 0.3

V

CC1, CC2

–0.3

6

SDA/OUT1, SCL/OUT2

–0.3

VDD + 0.3

VBUS_DET

–0.3

4

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 5.3.

Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±3000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

Supply voltage

4.5

5

5.5

V

VBUS

System VBUS voltage

4

5

28

V

VCONTR

OL

DC voltage range for control lines: ADDR, ID, DIR, INT_N/OUT3, SDA/OUT1, SCL/

OUT2, EN_N, CC1, and CC2.

0

5.5

V

DC voltage range for VBUSDET

0

4

V

VCONN

Supply for active cable (With VDD at 5 V)

4.75

5.5

V

TA

Operating free-air temperature

TUSB322I

–40

25

85

°C

5.4 Thermal Information

THERMAL METRIC(1)

TUSB322I

UNIT

RWB (X2QFN)

12 PINS

RθJA

Junction-to-ambient thermal resistance

169.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

68.1

°C/W

RθJB

Junction-to-board thermal resistance

83.4

°C/W

ψJT

Junction-to-top characterization parameter

2.2

°C/W

ψJB

Junction-to-board characterization parameter

83.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application

report, SPRA953.

TUSB322I

SLLSEO5D – OCTOBER 2015 – REVISED MARCH 2021

www.ti.com

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