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PACKAGE OUTLINE

1.9

1.7

1.9

1.7

0.8

0.7

0.05

0.00

8X 0.4

2X 1.2

8X

0.5

0.3

12X

0.25

0.15

4X

0.75

0.65

(0.2) TYP

(0.1) TYP

(0.2)

(0.1)

WQFN - 0.8 mm max height

RMG0012A

PLASTIC QUAD FLATPACK - NO LEAD

4226797/B 04/2024

0.05 C

0.07

C A B

0.05

C

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SEE DETAIL A

PIN 1 INDEX AREA

SEATING PLANE

PIN 1 ID

(45 X 0.1)

SYMM

SYMM

1

2

3

6

7

8

9

12

SCALE 6.000

40.000

DETAIL A

ALTERNATE SIDE WALL METAL

TYPICAL

A

B

C