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PACKAGE OUTLINE

C

16X

0.38

0.23

2.7 0.1

16X

0.5

0.3

1.0

0.8

(0.2) TYP

0.05

0.00

12X 0.65

4X

1.95

A

4.1

3.9

B

4.1

3.9

VQFN - 1 mm max height

RSA0016B

PLASTIC QUAD FLATPACK - NO LEAD

4219093/A 08/2021

PIN 1 INDEX AREA

0.08

SEATING PLANE

1

4

9

12

5

8

16

13

X 0.3)

(45

PIN 1 ID

0.1

C A B

0.05

C

EXPOSED

THERMAL PAD

SYMM

17

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

4. Reference JEDEC registration MO-220.

SCALE 3.300