13

AT24C01A/02/04/08A/16A

0180Z1–SEEPR–5/07

Notes: 1. This device is not recommended for new design. Please refer to AT24C01B datasheet. For 2.7V devices used in the 4.5V to

5.5V range, please refer to performance values in the AC and DC characteristics table.

2. “U” designates Green Package + RoHS compliant.

3. “H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.

4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please

contact Serial EEPROM Marketing.

AT24C01A Ordering Information(1)

Ordering Code

Package

Operation Range

AT24C01A-10PU-2.7(2)

AT24C01A-10PU-1.8(2)

AT24C01A-10SU-2.7(2)

AT24C01A-10SU-1.8(2)

AT24C01A-10TU-2.7(2)

AT24C01A-10TU-1.8(2)

AT24C01A-10TSU-1.8(2)

AT24C01AU3-10UU-1.8(2)

AT24C01AY1-10YU-1.8(2) (Not recommended for new

design)

AT24C01AY6-10YH-1.8(3)

8P3

8P3

8S1

8S1

8A2

8A2

5TS1

8U31

8Y1

8Y6

Lead-free/Halogen-free/

Industrial Temperature

(–40

°C to 85°C)

AT24C01A-W1.8-11(4)

Die Sale

Industrial Temperature

(–40

°C to 85°C)

Package Type

8P3

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8S1

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8A2

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8Y1

8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

8Y6

8-lead, 2.00 x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)

5TS1

5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)

8U3-1

8-ball, die Ball Grid Away Package (dBGA2)

Options

–2.7

Low-voltage (2.7V to 5.5V)

–1.8

Low-voltage (1.8V to 5.5V)