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TPL0102

SLIS134C – MARCH 2011 – REVISED SEPTEMBER 2015

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(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

(3)

All voltages are with respect to ground, unless otherwise specified.

6 Specifications

6.1 Absolute Maximum Ratings

(1) (2) (3)

MIN

MAX

UNIT

VDD to GND

Supply voltage

–0.3

7

V

VSS to GND

–7

0.3

V

VDD to VSS

7

V

VH, VL, VW

Voltage at resistor terminals

VSS – 0.3

VDD + 0.3

V

VI

Digital input voltage

–0.3

VDD + 0.3

V

IH, IL, IW

Pulse current

±20

mA

Continuous current

±2

mA

Tstg

Storage temperature

-65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VDD

Single supply operation (VSS = 0 V)

2.7

5.5

V

Dual supply operation (VSS = –VDD)

2.25

2.75

VH, VL

Terminal voltage range

VSS

VDD

V

VIH

Digital input voltage high (SCL, SDA, A0, A1, A2)

0.7 × VDD

5.5

V

VIL

Digital input voltage low (SCL, SDA, A0, A1, A2)

0

0.3 × VDD

V

IW

Wiper current

±2

mA

TA

Ambient temperature

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Thermal Information

THERMAL METRIC (1)

TPL0102

UNIT

PW (TSSOP)

RUC (X2QFN)

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

112.9

119.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

39.9

51.3

°C/W

RθJB

Junction-to-board thermal resistance

55.9

59.0

°C/W

ψJT

Junction-to-top characterization parameter

3.5

1.2

°C/W

ψJB

Junction-to-board characterization parameter

55.2

59.0

°C/W