TMUX7436F datasheet(5/50 Pages) TI2

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6.3 Thermal Information

THERMAL METRIC(1)

TMUX7436F

UNIT

PW (TSSOP)

RRP (WQFN)

16 PINS

RθJA

Junction-to-ambient thermal resistance

100.4

TBD

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

31.3

TBD

°C/W

RθJB

Junction-to-board thermal resistance

46.4

TBD

°C/W

ΨJT

Junction-to-top characterization parameter

1.7

TBD

°C/W

ΨJB

Junction-to-board characterization parameter

45.8

TBD

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX UNIT

VDD – VSS (1)

Power supply voltage differential

VDD

Positive power supply voltage

Source pin (Sx) voltage (non-fault condition)

VSS

VDD

VS to GND

Source pin (Sx) voltage to GND (fault condition)

–60

VS to VDD (2)

Source pin (Sx) voltage to VDD or VD (fault condition)

–85

VS to VSS (2)

Source pin (Sx) voltage to VSS or VD (fault condition)

Drain pin (Dx) voltage

VSS

VDD

VLOGIC

Logic control input pin voltage (EN, SELx, DR)

GND

VxF (3)

Logic output pin voltage (FF, SF)

GND

5.5

Ambient temperature

–40

125

°C

IDC

Continuous current through switch operating 1 channel,

TSSOP package

TA = 25°C

115

TA = 85°C

115

TA = 125°C

IDC

Continuous current through switch operating max number of

channels at the same time, TSSOP package

TA = 25°C

115

TA = 85°C

115

TA = 125°C

(1)

VDD and VSS can be any value as long as 8 V ≤ (VDD – VSS) ≤ 44 V, and the minimum VDD is met.

(2)

Source pin voltage (Sx) under a fault condition may not exceed 85 V from supply pins (VDD and VSS.) or drain pins (D, Dx).

(3)

Logic output pin (FF) is an open drain output and should be pulled up to a voltage within the maximum ratings.

www.ti.com

TMUX7436F

SCDS459A – OCTOBER 2022 – REVISED NOVEMBER 2022

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