TMP411 datasheet(4/60 Pages) TI2

4 / 60 page

TMP 411D x Q yyy R Q1

Device Name

(TMP411 or TMP411D)

I2C Address (A, B, C or D)

Only Automotive Qualified

TI Package Designator (DGK or DDF)

T&R Packing size

Only Grade-1 Automotive Qualified

Sensor Family

Figure 4-1. TMP411-Q1 and TMP411D-Q1 Device Nomenclature

Table 4-2. TMP411-Q1 and TMP411D-Q1 Device Nomenclature Description

FIELD DESCRIPTION

FIELD DETAIL

Sensor Family

TMP: Temperature Sensors

Device Name

411 or 411D

I2C Address

•

TMP411A-Q1/ TMP411DA-Q1 - 4Ch/ 1001100'b - 85°C default local/remote high temperature limit

•

TMP411B-Q1/ TMP411DB-Q1 - 4Dh/ 1001101'b - 85°C default local/remote high temperature limit

•

TMP411C-Q1/ TMP411DC-Q1 - 4Eh/ 1001110'b - 85°C default local/remote high temperature limit

•

TMP411D-Q1/ TMP411DD-Q1 - 4Ch/ 1001100'b - 110°C default local/remote high temperature limit

Automotive qualified

Applies to only automotive-qualified devices

TI Package Designator

TMP411-Q1:

•

DGK, VSSOP package, 1.1mm (max) height

TMP411D-Q1:

•

DDF, SOT23 package, 1.1mm (max) height

T and R Packing Size

Large T and R, SPQ (TMP411-Q1) = 2,500 units and SPQ (TMP411D-Q1) = 3,000 units

Automotive grade-1 qualified

AEC-Q100 Qualified for automotive applications

Table 4-3. TMP411-Q1 and TMP411D-Q1 devices Device Nomenclature Detail

PRODUCT

OUT

TMP411xQyyyRQ1

x indicates that the device has A, B, C, or D variant. These devices can ship with the legacy chip

(CSO: DM5) or the new chip (CSO: RFB). The reel packaging label provides date code information to

distinguish which chip is being used. Device performance for new and legacy chips is denoted throughout

the document.

yyy indicates that the package type of the device is DGK (VSSOP 8-pin).

TMP411DxQyyyRQ1

x indicates that the device has A, B, C, or D variant. TMP411D-Q1 has only CSO: RFB.

yyy indicates that the package type of the device is DDF (SOT23 8-pin).

TMP411-Q1, TMP411D-Q1

SBOS527G – DECEMBER 2010 – REVISED SEPTEMBER 2025

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