• Added specifications and graphs for the New Device and comparison of the Legacy Device throughout the

document ...........................................................................................................................................................1

• Added Device Comparison, Device Orderable Options, and Nomenclature Details tables............................... 3

• Deleted Machine Model (MM) Electrostatic discharge....................................................................................... 5

• Changed the specified temperature range for LM50B from -25°C to 100°C (in the legacy chip) to -40°C to

125°C (in the new chip)...................................................................................................................................... 5

• Added DBZ package “Thermal Information” for the New chip............................................................................5

• Added “Turn-on Time” for both Legacy chip and New chip................................................................................ 6

• Added “Operating current” and “Change of quiescent current” for the New chip............................................... 6

• Updated the Design Parameters table to correct typos....................................................................................16

Changes from Revision F (December 2016) to Revision G (January 2017)

Page

• Changed LMT90 to LM50 in VO description of Equation 1 ..............................................................................15

Changes from Revision E (September 2013) to Revision F (December 2016)

Page

• Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Detailed

Description section, Application and Implementation section, Power Supply Recommendations section,

Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable

Information section ............................................................................................................................................ 1

• Deleted the Temperature To Digital Converter (Parallel TRI-STATE Outputs for Standard Data Bus to µP

Interface) (125°C Full Scale) figure.................................................................................................................. 19

Changes from Revision C (February 2013) to Revision E (September 2013)

Page

• Added LM50-Q1 option throughout document................................................................................................... 1

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com

LM50, LM50HV

SNIS118I – JULY 1999 – REVISED OCTOBER 2025

Copyright © 2025 Texas Instruments Incorporated

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Product Folder Links: LM50 LM50HV