1.1

Electrical characteristics (curves)

Figure 1. Average forward power dissipation versus

average forward current

PF(AV)(W)

0.0

0.4

0.8

1.2

1.6

2.0

2.4

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

δ = 0.05

δ = 0.1

δ = 0.2

δ = 0.5

δ = 1

T

tp

δ=tp/T

IF(AV)(A)

Figure 2. Forward voltage drop versus forward current

(typical values)

IF(A)

0.01

0.10

1.00

10.00

0.0

0.4

0.8

1.2

1.6

2.0

2.4

2.8

Tj = 150 °C

VF(V)

Tj = 25 °C

Figure 3. Forward voltage drop versus forward current

(maximum values)

0.01

0.10

1.00

10.00

0.0

0.4

0.8

1.2

1.6

2.0

2.4

2.8

3.2

3.6

IF(A)

Tj = 150 °C

VF(V)

Tj = 25 °C

Figure 4. Relative variation of thermal impedance junction

to lead versus pulse duration

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1. E-04

1. E-03

1. E-02

1. E-01

1. E+00

1. E+01

Single pulse

SMBflat

tp(s)

Zth(j-l)/Rth(j-l)

Figure 5. Junction capacitance versus reverse voltage

applied (typical values)

C (pF)

1

10

100

1

10

100

1000

10000

VR(V)

MHz

= 1

F

VOSC = 30 mVRMS

Tj = 25 °C

Figure 6. Thermal resistance junction to ambient versus

copper surface under each lead

0

30

60

90

120

150

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Rth(j-a)(°C/W)

SMB-Flat

SCu(cm²)

Epoxy printed board FR4, copper thickness: 70 μm

STTH112-Y

Characteristics

DS10171 - Rev 3

page 3/8