© 2002 Microchip Technology Inc.

DS40151D-page 21

HCS512

18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)

Foot Angle

φ

04

80

48

15

12

0

15

12

0

β

Mold Draft Angle Bottom

15

12

0

15

12

0

α

Mold Draft Angle Top

0.51

0.42

0.36

.020

.017

.014

B

Lead Width

0.30

0.27

0.23

.012

.011

.009

c

Lead Thickness

1.27

0.84

0.41

.050

.033

.016

L

Foot Length

0.74

0.50

0.25

.029

.020

.010

h

Chamfer Distance

11.73

11.53

11.33

.462

.454

.446

D

Overall Length

7.59

7.49

7.39

.299

.295

.291

E1

Molded Package Width

10.67

10.34

10.01

.420

.407

.394

E

Overall Width

0.30

0.20

0.10

.012

.008

.004

A1

Standoff

§

2.39

2.31

2.24

.094

.091

.088

A2

Molded Package Thickness

2.64

2.50

2.36

.104

.099

.093

A

Overall Height

1.27

.050

p

Pitch

18

18

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

L

β

c

φ

h

45

°

1

2

D

p

n

B

E1

E

α

A2

A1

A

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-013

Drawing No. C04-051

§ Significant Characteristic