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PACKAGE OUTLINE

C

12X 0.65

2X

3.9

14X

0.30

0.17

6.6

6.2

TYP

SEATING

PLANE

0.15

0.05

0.25

GAGE PLANE

0 -8

1.2 MAX

2X (0.6)

NOTE 5

2X (0.4)

NOTE 5

2.59

1.89

2.6

1.9

4X (0 -12 )

B

4.5

4.3

A

5.1

4.9

NOTE 3

0.75

0.50

(0.15) TYP

PowerPAD TSSOP - 1.2 mm max height

PWP0014K

SMALL OUTLINE PACKAGE

4229706/B 12/2023

1

7

8

14

0.1

C A B

PIN 1 INDEX

AREA

SEE DETAIL A

0.1 C

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. Reference JEDEC registration MO-153.

5. Features may differ or may not be present.

TM

PowerPAD is a trademark of Texas Instruments.

A 20

DETAIL A

TYPICAL

SCALE 2.500

THERMAL

PAD

1

7

8

14

15