| công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
|
ICS853017AM bảng dữ liệu(PDF) 11 Page - Integrated Device Technology |
|
|
|||||||||||||||||||||||||||||
ICS853017AM bảng dữ liệu(HTML) 11 Page - Integrated Device Technology |
|
11 / 15 page ![]() IDT™ / ICS™ 2.5V, 3.3V, 5V LVPECL/ECL RECEIVER 11 ICS853017AM REV. B OCTOBER 24, 2007 ICS853017 QUAD, 1-TO-1, DIFFERENTIAL-TO-2.5V, 3.3V, 5V LVPECL/ECL RECEIVER PRELIMINARY POWER CONSIDERATIONS This section provides information on power dissipation and junction temperature for the ICS853017. Equations and example calculations are also provided. 1. Power Dissipation. The total power dissipation for the ICS853017 is the sum of the core power plus the power dissipated in the load(s). The following is the power dissipation for V CC = 5.5V, which gives worst case results. NOTE: Please refer to Section 3 for details on calculating power dissipated in the load. • Power (core) MAX = V CC_MAX * I EE_MAX = 5.5V * 46mA = 253mW • Power (outputs) MAX = 30.94mW/Loaded Output pair If all outputs are loaded, the total power is 4 * 30.94mW = 123.76mW Total Power _MAX (5.5V, with all outputs switching) = 123.76mW + 253mW = 376.76mW 2. Junction Temperature. Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The maximum recommended junction temperature for HiPerClockS TM devices is 125°C. The equation for Tj is as follows: Tj = θ JA * Pd_total + TA Tj = Junction Temperature θ JA = Junction-to-Ambient Thermal Resistance Pd_total = Total Device Power Dissipation (example calculation is in section 1 above) T A = Ambient Temperature In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θ JA must be used. Assuming no air flow and a multi-layer board, the appropriate value is 46.2°C/W per Table 6 below. Therefore, Tj for an ambient temperature of 85°C with all outputs switching is: 85°C + 0.377W * 46.2°C/W = 102.4°C. This is well below the limit of 125°C. This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow, and the type of board (single layer or multi-layer). θθθθθ JA by Velocity (Linear Feet per Minute) 0 200 500 Single-Layer PCB, JEDEC Standard Test Boards 83.2°C/W 65.7°C/W 57.5°C/W Multi-Layer PCB, JEDEC Standard Test Boards 46.2°C/W 39.7°C/W 36.8°C/W NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs. TABLE 6. THERMAL RESISTANCE θθθθθ JA FOR 20-PIN SOIC, FORCED CONVECTION |
|
|
Link URL |
| Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không? [ DONATE ] |
Alldatasheet là | Quảng cáo | Liên lạc với chúng tôi | Chính sách bảo mật | Liên kết đến bảng dữ liệu | Trao đổi link | Tìm kiếm theo nhà sản xuất All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |