RM48L950DPGET datasheet(49/182 Pages) TI2

tên linh kiện	RM48L950DPGET

Giải thích chi tiết về linh kiện	RM48Lx50 16- and 32-Bit RISC Flash Microcontroller

PDF	182 Pages

Scroll/Zoom	100%

nhà sản xuất	TI2 [Texas Instruments]

Trang chủ	https://www.ti.com

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49 / 182 page

RM48L950, RM48L750, RM48L550

www.ti.com

SPNS174C – APRIL 2012 – REVISED JUNE 2015

5.9

Thermal Resistance Characteristics

Table 5-2 shows the thermal resistance characteristics for the QFP - PGE mechanical package.

Table 5-3 shows the thermal resistance characteristics for the BGA - ZWT mechanical package.

Table 5-2. Thermal Resistance Characteristics (PGE Package)

°C / W

Junction-to-free air thermal resistance, Still air using JEDEC 2S2P test

ΘJA

board

ΘJB

Junction-to-board thermal resistance

26.3

ΘJC

Junction-to-case thermal resistance

6.7

ΨJT

Junction-to-package top, Still air

0.10

Table 5-3. Thermal Resistance Characteristics (ZWT Package)

°C / W

Junction-to-free air thermal resistance, Still air (includes 5 × 5 thermal via

ΘJA

18.8

cluster in 2s2p PCB connected to first ground plane)

ΘJB

Junction-to-board thermal resistance

14.1

ΘJC

Junction-to-case thermal resistance

7.1

Junction-to-package top, Still air (includes 5 × 5 thermal via cluster in

ΨJT

0.33

2s2p PCB connected to first ground plane)

Specifications

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