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LMV324AM14X bảng dữ liệu(PDF) 9 Page - ON Semiconductor

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Giải thích chi tiết về linh kiện  General-Purpose, Low Voltage, Rail-to-Rail Output Amplifiers
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© 2002 Fairchild Semiconductor Corporation
www.fairchildsemi.com
LMV321 / LMV358 / LMV324 Rev. 2.9
8
Application Information
General Description
The LMV3XX family are single supply, general-purpose,
voltage-feedback amplifiers that are pin-for-pin compati-
ble and drop in replacements with other industry standard
LMV321, LMV358, and LMV324 amplifiers. The LMV3XX
family is fabricated on a CMOS process, features a rail-
to-rail output, and is unity gain stable.
The typical non-inverting circuit schematic is shown in
Figure1.
Figure 1. Typical Non-inverting configuration
Power Dissipation
The maximum internal power dissipation allowed is di-
rectly related to the maximum junction temperature. If the
maximum junction temperature exceeds 150°C, some
performance degradation will occur. If the maximum junc-
tion temperature exceeds 175°C for an extended time,
device failure may occur.
Driving Capacitive Loads
The Frequency Response vs. CL plot on page 4, illus-
trates the response of the LMV3XX family. A small series
resistance (RS) at the output of the amplifier, illustrated in
Figure 2, will improve stability and settling performance.
Rs values in the Frequency Response vs. CL plot were
chosen to achieve maximum bandwidth with less than
1dB of peaking. For maximum flatness, use a larger RS.
As the plot indicates, the LMV3XX family can easily drive
a 200 pF capacitive load without a series resistance. For
comparison, the plot also shows the LMV321 driving a
200 pF load with a 225
Ω series resistance.
Driving a capacitive load introduces phase-lag into the
output signal, which reduces phase margin in the amplifi-
er. The unity gain follower is the most sensitive configura-
tion. In a unity gain follower configuration, the LMV3XX
family requires a 450
Ω series resistor to drive a 200 pF
load. The response is illustrated in Figure 3.
Figure 2. Typical Topology for driving a capacitive
load
Figure 3. Frequency Response vs. CL for unity gain
configuration
Layout Considerations
General layout and supply bypassing play major roles in
high frequency performance. Fairchild has evaluation
boards to use as a guide for high frequency layout and as
aid in device testing and characterization. Follow the
steps below as a basis for high frequency layout:
• Include 6.8
μF and 0.01 μF ceramic capacitors
• Place the 6.8
μF capacitor within 0.75 inches of the
power pin
• Place the 0.01
μF capacitor within 0.1 inches of the
power pin
• Remove the ground plane under and around the part,
especially near the input and output pins to reduce
parasitic capacitance
• Minimize all trace lengths to reduce series
inductances
Refer to the evaluation board layouts shown in Figure 5
on page 8 for more information.
+
-
LMV3XX
Rf
0.01
μF
6.8
μF
Out
+In
+Vs
+
Rg
+
-
10k
Ω
10k
Ω
Rs
CL
2k
Ω
LMV3XX
Frequency (M H z )
0.01
0.1
1
10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
3
CL = 50pF
Rs = 0
CL = 100pF
Rs = 400
Ω
CL = 200pF
Rs = 450
Ω



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