2. Land Dimensions

Please confirm the suitable land dimension by evaluating of the actual SET / PCB.

Table 1 Flow Soldering Method

Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 2.0x1.25mm.

(in mm)

Resistance to PCB bending stress may be improved by designing the “a” dimension with solder resist.

Table 2 Reflow Soldering Method

(in mm)

0.8 to 1.1

GQM

22

2.8×2.8

2.2 to 2.5

0.8 to 1.0

1.9 to 2.3

GQM

21

2.0×1.25

1.0 to 1.2

0.6 to 0.7

0.6 to 0.8

1.6×0.8(±0.15)

0.7 to 0.9

0.7 to 0.8

0.8 to 1.0

GQM

18

1.6×0.8(±0.10)

0.6 to 0.8

0.6 to 0.7

0.25 to 0.35

GQM

15

1.0×0.5(±0.05)

0.3 to 0.5

0.35 to 0.45

0.4 to 0.6

GQM

03

0.6×0.3(±0.03)

0.2 to 0.25

0.2 to 0.3

0.8 to 1.1

Series

Chip Dimension

(L/W) Code

Chip(L×W)

(Dimensions Tolerance)

a

b

c

GQM

21

2.0×1.25

1.0 to 1.2

0.9 to 1.0

c

GQM

18

1.6×0.8

0.6 to 1.0

0.8 to 0.9

0.6 to 0.8

Series

Chip Dimension

(L/W) Code

Chip(L×W)

a

b

GQM1555C2DR10WB01-01A

27