PCM2903C

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SBFS038A – JUNE 2012 – REVISED SEPTEMBER 2015

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted).

(1)

MIN

MAX

UNIT

Supply voltage, VCCC, VCCP1, VCCP2, VCCX, VDD

–0.3

4

V

Supply voltage differences, VCCC, VCCP1, VCCP2, VCCX, VDD

±0.1

V

Ground voltage differences, AGNDC, AGNDP, AGNDX, DGND, DGNDU

±0.1

V

SEL0, SEL1, DIN

–0.3

6.5

V

Digital input

voltage

D+, D–, HID0, HID1, HID2, XTI, XTO, DOUT, SSPND

–0.3

(VDD + 0.3) < 4

V

Analog input voltage VINL, VINR, VCOM, VOUTR, VOUTL

–0.3

(VCCC + 0.3) < 4

V

Input current (any pins except supplies)

±10

mA

Ambient temperature under bias

–40

125

°C

Junction temperature TJ

150

°C

Lead temperature (soldering, 5 s)

260

°C

Package temperature (IR reflow, peak)

250

°C

Storage temperature, Tstg

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

3

3.3

3.6

V

Supply current

ADC, DAC operation

54

70

mA

USB suspend state

250

µA

Ambient temperature

0

25

85

°C

7.4 Thermal Information

PCM2903C

THERMAL METRIC(1)

DB (SSOP)

UNIT

28 PINS

RθJA

Junction-to-ambient thermal resistance

64.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

24.5

°C/W

RθJB

Junction-to-board thermal resistance

25.4

°C/W

ψJT

Junction-to-top characterization parameter

2.0

°C/W

ψJB

Junction-to-board characterization parameter

25

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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