5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (3)

MIN

MAX

UNIT

VIN

Input voltage

–0.3

6

V

VOUT

Output voltage

–0.3

See(2)

V

VEN

Enable input voltage

–0.3

6

V

Continuous power dissipation(4)

Internally limited

W

TJMAX

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those indicated under the Recommended

Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Abs Max VOUT is the lessor of VIN + 0.3V, or 6V.

(3)

All voltages are with respect to the GND pin.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1) (2)

MIN

MAX

UNIT

VIN

Input supply voltage

2.2

5.5

V

VEN

Enable input voltage

0

5.5

V

IOUT

Output current

0

250

mA

TJ

Junction temperature

–40

125

°C

TA

Ambient temperature(3)

–40

85

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the GND pin.

(3)

In applications where high power dissipation and poor package thermal resistance is present, the maximum ambient temperature can

need to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP

= 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of

the device or package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). See the

Application and Implementation section.

LP5907

SNVS798Q – APRIL 2012 – REVISED JULY 2025

www.ti.com

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