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SPC582B50E3 bảng dữ liệu(PDF) 42 Page - STMicroelectronics |
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SPC582B50E3 bảng dữ liệu(HTML) 42 Page - STMicroelectronics |
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42 / 111 page ![]() Electrical characteristics SPC582B60x, SPC582B54x, SPC582B50x 42/111 DS11597 Rev 5 4.11.2 RC oscillator 16 MHz 1. The range is selectable by UTEST miscellaneous DCF client XOSC_FREQ_SEL. 2. The XTAL frequency, if used to feed the PPL0 (or PLL1), shall obey the minimum input frequency limit set for PLL0 (or PLL1). 3. This value is determined by the crystal manufacturer and board design, and it can potentially be higher than the maximum provided. 4. Proper PC board layout procedures must be followed to achieve specifications. 5. Crystal recovery time is the time for the oscillator to settle to the correct frequency after adjustment of the integrated load capacitor value. 6. Applies to an external clock input and not to crystal mode. 7. See crystal manufacturer’s specification for recommended load capacitor (CL) values. The external oscillator requires external load capacitors when operating from 8 MHz to 16 MHz. Account for on-chip stray capacitance (CS_EXTAL/CS_XTAL) and PCB capacitance when selecting a load capacitor value. When operating at 20 MHz/40 MHz, the integrated load capacitor value is selected via S/W to match the crystal manufacturer’s specification, while accounting for on-chip and PCB capacitance. 8. Amplitude on the EXTAL pin after startup is determined by the ALC block, that is the automatic level control circuit. The function of the ALC is to provide high drive current during oscillator startup, but reduce current after oscillation in order to reduce power, distortion, and RFI, and to avoid over driving the crystal. The operating point of the ALC is dependent on the crystal value and loading conditions. 9. IXTAL is the oscillator bias current out of the XTAL pin with both EXTAL and XTAL pins grounded. This is the maximum current during startup of the oscillator. Table 22. Internal RC oscillator electrical specifications Symbol C Parameter Conditions Value Unit Min Typ Max fTarget CC D IRC target frequency — — 16 — MHz δfvar_noT CC P IRC frequency variation without temperature compensation T < 150 °C –5 — 5 % δfvar_T CC T IRC frequency variation with temperature compensation T < 150 °C –3 — 3 % δfvar_SW T IRC software trimming accuracy Trimming temperature –0.5 +0.3 0.5 % Tstart_noT CC T Startup time to reach within fvar_noT Factory trimming already applied —— 5 µs Tstart_T CC T Startup time to reach within fvar_T Factory trimming already applied —— 120 µs IFIRC CC T Current consumption on HV power supply (1) After Tstart_T — — 1200 µA 1. The actual consumption difference can be higher due to additional consumption of core logic clocked by RCOSC16M. |
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