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SPC560D30X bảng dữ liệu(PDF) 10 Page - STMicroelectronics

tên linh kiện SPC560D30X
Giải thích chi tiết về linh kiện  32-bit MCU family built on the Power Architecture for automotive body electronics applications
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
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SPC560D30X bảng dữ liệu(HTML) 10 Page - STMicroelectronics

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Package pinouts and signal descriptions
SPC560D30x, SPC560D40x
10/82
DS6494 Rev 8
Figure 3 shows the SPC560D30x and SPC560D40x in the LQFP64 package.
Figure 3. LQFP64 LQFP pin configuration (top view)
3.2
Pad configuration during reset phases
All pads have a fixed configuration under reset.
During the power-up phase, all pads are forced to tristate.
After power-up phase, all pads are forced to tristate with the following exceptions:
PA[9] (FAB) is pull-down. Without external strong pull-up the device starts fetching from
flash.
PA[8] (ABS[0]) is pull-up.
RESET pad is driven low. This is pull-up only after PHASE2 reset completion.
JTAG pads (TCK, TMS and TDI) are pull-up while TDO remains tristate.
Precise ADC pads (PB[7:4] and PD[11:0]) are left tristate (no output buffer available).
Main oscillator pads (EXTAL, XTAL) are tristate.
3.3
Voltage supply pins
Voltage supply pins are used to provide power to the device. Two dedicated pins are used
for 1.2 V regulator stabilization.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PB[3]
PC[9]
PA[2]
PA[1]
PA[0]
VSS_HV
VDD_HV
VSS_HV
RESET
VSS_LV
VDD_LV
VDD_BV
PC[10]
PB[0]
PB[1]
PC[6]
PA[11]
PA[10]
PA[9]
PA[8]
PA[7]
PA[3]
PB[15]
PB[14]
PB[13]
PB[12]
PB[11]
PB[7]
PB[6]
PB[5]
VDD_HV_ADC
VSS_HV_ADC
LQFP64



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