7 Specifications

7.1 Absolute Maximum Ratings

See (1) (2)

MIN

MAX

UNIT

Supply Voltage Pin

9

V

Power Dissipation(1)

1100

mW

V8

15

V

V3

−10

V

V3

V4 + 0.5

V

Operating Temperature Range

LM567CM, LM567CN

0

70

°C

PDIP Package

Soldering (10 s)

260

°C

SOIC Package

Vapor Phase (60 s)

215

°C

Infrared (15 s)

220

°C

Storage temperature range, Tstg

−65

150

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions

indicate conditions for which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC

and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device

is within the Recommended Operating Conditions. Specifications are not ensured for parameters where no limit is given, however, the

typical value is a good indication of device performance.

(2)

See http://www.ti.com for other methods of soldering surface mount devices.

7.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply Voltage

3.5

8.5

V

VIN

Input Voltage Level

–8.5

8.5

V

TA

Operating Temperature Range

–20

120

°C

7.3 Thermal Information

THERMAL METRIC(1)

LM567C

UNIT

D (SOIC)

P (PDIP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

107.5

53.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

54.6

42.3

RθJB

Junction-to-board thermal resistance

47.5

30.2

ψJT

Junction-to-top characterization parameter

10.0

19.6

ψJB

Junction-to-board characterization parameter

47.0

30.1

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, (SPRA953).

LM567, LM567C

SNOSBQ4F – MAY 1999 – REVISED JANUARY 2022

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