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ISO7760DBQR bảng dữ liệu(PDF) 8 Page - Texas Instruments |
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ISO7760DBQR bảng dữ liệu(HTML) 8 Page - Texas Instruments |
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8 / 52 page ![]() 5.4 Thermal Information THERMAL METRIC (1) ISO776x UNIT DW (SOIC) DBQ (SSOP) 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 60.3 86.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 24.0 26.9 °C/W RθJB Junction-to-board thermal resistance 29.3 36.6 °C/W ψJT Junction-to-top characterization parameter 3.3 1.7 °C/W ψJB Junction-to-board characterization parameter 28.7 36.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 5.5 Power Ratings PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ISO7760 PD Maximum power dissipation (both sides) VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 50-MHz 50% duty cycle square wave 314 mW PD1 Maximum power dissipation (side-1) 55 mW PD2 Maximum power dissipation (side-2) 259 mW ISO7761 PD Maximum power dissipation (both sides) VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 50-MHz 50% duty cycle square wave 314 mW PD1 Maximum power dissipation (side-1) 88 mW PD2 Maximum power dissipation (side-2) 226 mW ISO7762 PD Maximum power dissipation (both sides) VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 50-MHz 50% duty cycle square wave 314 mW PD1 Maximum power dissipation (side-1) 122 mW PD2 Maximum power dissipation (side-2) 192 mW ISO7763 PD Maximum power dissipation (both sides) VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 50-MHz 50% duty cycle square wave 314 mW PD1 Maximum power dissipation (side-1) 157 mW PD2 Maximum power dissipation (side-2) 157 mW ISO7760, ISO7761, ISO7762, ISO7763 SLLSER1H – AUGUST 2017 – REVISED JANUARY 2024 www.ti.com 8 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: ISO7760 ISO7761 ISO7762 ISO7763 |
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