ISO6760FDWR.B datasheet(8/50 Pages) TI2

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6.4 Thermal Information

THERMAL METRIC (1)

ISO676x

UNIT

DW (SOIC)

16 PINS

RθJA

Junction-to-ambient thermal resistance

68.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

31.8

°C/W

RθJB

Junction-to-board thermal resistance

32.7

°C/W

ψJT

Junction-to-top characterization parameter

13.5

°C/W

ψJB

Junction-to-board characterization parameter

32.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

°C/W

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO6760

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, Input a 25-MHz 50% duty cycle

square wave

192

PD1

Maximum power dissipation (side-1)

PD2

Maximum power dissipation (side-2)

147

ISO6761

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, Input a 25-MHz 50% duty cycle

square wave

197

PD1

Maximum power dissipation (side-1)

PD2

Maximum power dissipation (side-2)

134

ISO6762

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, Input a 25-MHz 50% duty cycle

square wave

197

PD1

Maximum power dissipation (side-1)

PD2

Maximum power dissipation (side-2)

116

ISO6763

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, Input a 25-MHz 50% duty cycle

square wave

196

PD1

Maximum power dissipation (side-1)

PD2

Maximum power dissipation (side-2)

ISO6760, ISO6761, ISO6762, ISO6763

SLLSFK0E – AUGUST 2021 – REVISED FEBRUARY 2023

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Product Folder Links: ISO6760 ISO6761 ISO6762 ISO6763

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