www.ti.com

EXAMPLE BOARD LAYOUT

10X (0.6)

(R0.05) TYP

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

4X (0.242)

12X (0.6)

18X (0.3)

(2.8)

(3.2)

2X (0.5)

2X (1.1)

4X (R0.2)

4X (0.75)

VQFN - 1 mm max height

REL0014A

PLASTIC QUAD FLATPACK - NO LEAD

4228616/A 04/2022

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SYMM

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 20X

1

6

7

8

13

14

METAL UNDER

SOLDER MASK

TYP

SOLDER MASK

OPENING

TYP

METAL EDGE

SOLDER MASK

OPENING

EXPOSED METAL

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

EXPOSED

METAL

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DEFINED

SOLDER MASK DETAILS

www.ti.com

INA745A, INA745B

SBOSAC3B – JULY 2023 – REVISED AUGUST 2025

Copyright © 2025 Texas Instruments Incorporated

Submit Document Feedback

41

Product Folder Links: INA745A INA745B