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USB3106 bảng dữ liệu(PDF) 4 Page - Global Connector Technology

tên linh kiện USB3106
Giải thích chi tiết về linh kiện  Micro USB Receptacle, Type A/B, Vertical, Through-Hole with 2.30mm (Standard) Shell Stakes
PDF  6 Pages
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nhà sản xuất  GCT [Global Connector Technology]
Trang chủ  https://gct.co/
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USB3106 bảng dữ liệu(HTML) 4 Page - Global Connector Technology

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PRODUCT SPECIFICATION
Part
Number
USB3106
Rev
A
Date
03/12/13
Product
Description
Micro USB Receptacle, Type A/B, Vertical, Through-Hole with
2.30mm (Standard) Shell Stakes
Page
4 
Doc
Number
USB3106-SPEC
Prepared
AO
Checked
RM
Approved
VJ
 
 
 
www.gct.co
Item
Test Condition
Requirement
Mechanical Shock
Mated USB connectors are subjected to
5.35 GRMS. 15minutes in each of three
mutually perpendicular planes. In
accordance with EIA-364-28.
Test Condition V Test Letter A
Appearance: No Damage
Contact Resistance:
10 mΩ max change allowed.
Discontinuity: 1 microsecond max.
6.3 Environmental Performance and Others.
Item
Test Condition
Requirement
Thermal Shock
Subject the mated connectors to 10
cycles between -55°C to +85°C.
In accordance with EIA364-32,
Test Condition I.
Appearance: No Damage
Contact Resistance:
10 mΩ max change allowed.
Humidity Test
168 Hours minimum (seven complete
cycles) In accordance with EIA-364-31.
Test Method III
Appearance: No Damage
Contact Resistance:
10 mΩ max change allowed.
Salt Spray
Subject mated/unmated connectors to 5%
salt-solution concentration, 35°C for 24
hours. In accordance with EIA-364-26.
No visible rust
Temperature Life
Mate plugs and expose to 85 +/- 2°C for
500 hours, Upon completion of the
exposure period, the test specimens shall
be conditioned at ambient room
conditions for 1 to 2 hours, after which
the specified measurements shall be
performed. In accordance with
EIA-364-17.
Appearance: No Damage
Contact Resistance:
10 mΩ max Change allowed.
Solderability
Dip solder-tails in solder bath at
245 +/- 5°C for 4.5 ~ 5.5 seconds
In accordance with MIL-STD-202F,
Method 208
95% of immersed area must show
no voids, pin holes
Resistance to Soldering
Heat
(Wave Solder)
Subject mate connectors to chamfer with
temperature: 260 +/- 5 °C
time: 3-5 seconds
Without deformation of case or
excessive looseness of the
terminals (pin)
Resistance to Soldering
Heat
(Reflow Solder)
Subject mate connectors to reflow
machine with peak temperature:
260 +/- 5°C
peak temperature duration: 10 seconds
Without deformation of case or
excessive looseness of the
terminals (pin)
 
 



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