CB35000 datasheet(9/16 Pages) STMICROELECTRONICS

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CB35000 SERIES

Ball Grid Array (BGA) packages are available

from 160 to 500 pins and SBC types allow the pin

count to reach the area of 1000 pins. Pin counts

for through board mounting (PGA) range up to

480.

The diversity in pin count and package style gives

the designer the opportunity to ﬁnd the best

compromise

for

system

size,

cost

and

performance requirements.

All

packages

for

the

military

market

are

hermetically

sealed

meet

MIL-STD-883

Method. Prototypes are developed in ceramic

packages for fast turnaround evaluation.

Packages in Production

Packages in Development

NUMBER

OF LEADS

(Pins)

PACKAGE NAME

PQFP

TQFP

BGA

PLCC

CPGA

POWER PQFP

Slug/Spreader

100

120

128

144

160

176

180

208

224

225

256

257

304

313

400

480

PACKAGE AVAILABILITY

The

CB35000

Series

designed

compatible with QFP, BGA and SBC package

types, in addition to the more traditional types

found.

The options include Plastic Leaded Chip Carriers

(PLCC) from 28 to 84 pins, while the Metric Quad

Flat Pack (xQFP) offering ranges up to 208 pins.

Both high performance and high power variants

are available as well as the TQFP thin types.

Figure 6

Packaging Capability

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