ADS54J40 datasheet(6/88 Pages) TI2

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ADS54J20

SBAS766B – MAY 2016 – REVISED JANUARY 2017

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(1)

SYSREF must be applied for the device to initialize; see the SYSREF Signal section for details.

(2)

After power-up, always use a hardware reset to reset the device for the first time; see Table 65 for details.

(3)

Operating 0.5 dB below the maximum-supported amplitude is recommended to accommodate gain mismatch in interleaving ADCs.

(4)

At high frequencies, the maximum supported input amplitude reduces; see Figure 36 for details.

(5)

See Table 10 and Table 12.

(6)

Prolonged use above the nominal junction temperature can increase the device failure-in-time (FIT) rate.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

NOM

MAX

UNIT

Supply voltage range

AVDD3V

2.85

3.0

3.6

AVDD

1.8

1.9

2.0

DVDD

1.7

1.9

2.0

IOVDD

1.1

1.15

1.2

Analog inputs

Differential input voltage range

1.9

VPP

Input common-mode voltage

2.0

Maximum analog input frequency for a 1.9-VPP input

amplitude(3)(4)

400

MHz

Clock inputs

Input clock frequency, device clock frequency

250(5)

1000

MHz

Input clock amplitude differential

(VCLKP – VCLKM)

Sine wave, ac-coupled

0.75

1.5

VPP

LVPECL, ac-coupled

0.8

1.6

LVDS, ac-coupled

0.7

Input device clock duty cycle

45%

50%

55%

Temperature

Operating free-air, TA

–40

ºC

Operating junction, TJ

105(6)

125

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

ADS54J20

UNIT

RMP (VQFNP)

72 PINS

RθJA

Junction-to-ambient thermal resistance

22.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

5.1

°C/W

RθJB

Junction-to-board thermal resistance

2.4

°C/W

ψJT

Junction-to-top characterization parameter

0.1

°C/W

ψJB

Junction-to-board characterization parameter

2.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

0.4

°C/W

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