www.ti.com

EXAMPLE STENCIL DESIGN

(6.5)

60X (0.5)

64X (1.5)

64X (0.3)

(R0.05) TYP

(11.4)

(11.4)

PowerPAD

TQFP - 1.2 mm max height

PAP0064F

PLASTIC QUAD FLATPACK

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

TM

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:6X

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

BASED ON

0.125 THICK STENCIL

SYMM

SYMM

METAL COVERED

BY SOLDER MASK

64

49

17

32

33

48

1

16

65

4226412/A 11/2020

5.49 X 5.49

0.175

5.93 X 5.93

0.15

6.5 X 6.5 (SHOWN)

0.125

7.27 X 7.27

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS