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TMS320DM647 bảng dữ liệu(PDF) 163 Page - Texas Instruments

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TMS320DM647 bảng dữ liệu(HTML) 163 Page - Texas Instruments

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7
Mechanical Data
7.1 Thermal Data for ZUT
7.1.1 Packaging Information
TMS320DM647/TMS320DM648
Digital Media Processor
SPRS372A – MAY 2007 – REVISED JUNE 2007
The following table(s) show the thermal resistance characteristics for the ZUT mechanical package.
See Power Application Report.
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZUT]
C/W(1)
AIR FLOW (m/s)(2)
R
ΘJC
R
ΘJC Junction-to-case
1.2
N/A
R
ΘJB
R
ΘJB Junction-to-board
8.5
N/A
R
ΘJA
R
ΘJA Junction-to-free air
22.0
0.0
15.2
1.0
12.0
2.0
10.8
3.0
PsiJT
PsiJT Junction-to-package top
0.5
0.0
0.5
1.0
0.5
2.0
0.5
3.0
PsiJB
PsiJB Junction-to-board
8.0
0.0
7.3
1.0
6.7
2.0
6.3
3.0
(1)
The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC
defined 1S2P system and will change based on environment as well as application.
For more information, see these three EIA/JEDEC standards:
•
EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
•
EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
.
(2)
m/s = meters per second
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
Submit Documentation Feedback
Mechanical Data
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