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07/05/25

Thick Film General Purpose Chip Resistors

WR12, WR08, WR06, WR04

Newark.com/multicomp-pro

Farnell.com/multicomp-pro

sg.element14.com/b/multicomp-pro

Description

The resistors are constructed in a high grade ceramic body (aluminium oxide). Internal metal

electrodes are added at each end and connected by a resistive paste that is applied to the top surface

of the substrate. The composition of the paste is adjusted to give the approximate resistance required

and the value is trimmed to within tolerance by laser cutting of this resistive layer.

The resistive layer is covered with a protective coat. Finally, the two external end terminations are

added. For ease of soldering the outer layer of these end terminations is a Tin (lead free) alloy.

Features

• High reliability and stability

• Reduced size of final equipment

• Lower assembly costs and halogen free products

• Higher component and equipment reliability

Application

• Consumer electrical equipment

• EDP, Computer application

• Telecom application

Construction of Chip-R

Laser Trimmed

Resistive element

Primary Layer

Termination

Marking

Protective Layer

Alumina Substrate

Item

General Specification

Series No.

WR12

WR08

WR06

WR04

Size code

1206(3216)

0805(2012)

0603(1608)

0402(1005)

Resistance Range

1Ω~10MΩ (±5% tolerance), Jumper

1Ω~10MΩ (±1% tolerance)

Resistance Tolerance

±1%

E96/E24

±5%

E24

±1%

E96/E24

±5%

E24

±1%

E96/E24

±5%

E24

±1%

E96/E24

±5%

E24

TCR (ppm/°C)

10MΩ ≥R >10Ω

R≤10Ω

≤ ± 100

-200 to +400

Max. dissipation

@ T

amb=70°C

1/4 W

1/8 W

1/10 W

1/16 W

Max. Operation

Voltage (DC or RMS)

200V

150V

75V

50V

Max. Overload

Voltage (DC or RMS)

400V

300V

150V

100V

Climatic category

55/155/56

Quick Reference Data