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EXAMPLE BOARD LAYOUT

52X (0.5)

48X (0.65)

2X (10)

9X ( 1)

2X (10)

0.05 MIN

TYP

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

(R0.05) TYP

(0.3)

(1.45) TYP

(0.7)

(1.45) TYP

8X (1.1)

52X (0.3)

4X ( 0.5)

QFM - 2.1 mm max height

MOZ0065A

QUAD FLAT MODULE

4229851/A 07/2023

NOTES: (continued)

3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments

literature number SLUA271 (www.ti.com/lit/slua271).

LAND PATTERN EXAMPLE

SCALE:10X

PKG

PKG

SEE SOLDER MASK

DETAILS

1

2

14

15

16

28

29

30

42

43

44

56

57

59

60

62

65

63

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

9X

(45 X 0.5)

58

61

64

METAL EDGE

SOLDER MASK

OPENING

EXPOSED

METAL

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

EXPOSED

METAL

SOLDER MASK

DEFINED

CC3300MOD, CC3301MOD

SWRS333A – JULY 2025 – REVISED AUGUST 2025

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32

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Product Folder Links: CC3300MOD CC3301MOD