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LP55231SQE/NOPB.B bảng dữ liệu(PDF) 2 Page - Texas Instruments

tên linh kiện LP55231SQE/NOPB.B
Giải thích chi tiết về linh kiện  LP55231 Nine-Channel RGB, White-LED Driver With Internal Program Memory and Integrated Charge Pump - WQFN
PDF  59 Pages
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Trang chủ  https://www.ti.com
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LP55231SQE/NOPB.B bảng dữ liệu(HTML) 2 Page - Texas Instruments

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LP55231
SNOSCR5D – MARCH 2013 – REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LP55231
Submit Documentation Feedback
Copyright © 2013–2016, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Pin Configuration and Functions ......................... 3
6
Specifications......................................................... 4
6.1
Absolute Maximum Ratings ...................................... 4
6.2
ESD Ratings.............................................................. 4
6.3
Recommended Operating Conditions ....................... 4
6.4
Thermal Information .................................................. 4
6.5
Electrical Characteristics........................................... 5
6.6
Charge Pump Electrical Characteristics ................... 5
6.7
LED Driver Electrical Characteristics ........................ 6
6.8
LED Test Electrical Characteristics........................... 6
6.9
Logic Interface Characteristics.................................. 6
6.10
Recommended External Clock Source Conditions . 7
6.11
Serial Bus Timing Parameters (SDA, SCL) ............ 7
6.12
Typical Characteristics ............................................ 8
7
Detailed Description ............................................ 10
7.1
Overview ................................................................. 10
7.2
Functional Block Diagram ....................................... 10
7.3
Feature Description................................................. 11
7.4
Device Functional Modes........................................ 17
7.5
Programming........................................................... 18
7.6
Register Maps ......................................................... 20
8
Application and Implementation ........................ 46
8.1
Application Information............................................ 46
8.2
Typical Applications ................................................ 46
9
Power Supply Recommendations ...................... 50
10
Layout................................................................... 50
10.1
Layout Guidelines ................................................. 50
10.2
Layout Example .................................................... 50
11
Device and Documentation Support ................. 51
11.1
Device Support...................................................... 51
11.2
Trademarks ........................................................... 51
11.3
Receiving Notification of Documentation Updates 51
11.4
Community Resources.......................................... 51
11.5
Electrostatic Discharge Caution ............................ 51
11.6
Glossary ................................................................ 51
12
Mechanical, Packaging, and Orderable
Information ........................................................... 51
4 Revision History
Changes from Revision C (November 2016) to Revision D
Page
Added top nav icon for TI Designs ........................................................................................................................................ 1
Changed variable 1 spanning to go from Bit [3] to Bit [2] and variable 2 span from Bit [1] to Bit [0] in table 7 .................. 39
Changes from Revision B (May 2016) to Revision C
Page
Changed wording of data sheet title....................................................................................................................................... 1
Changes from Revision A (October 2014) to Revision B
Page
Added several new Applications ............................................................................................................................................ 1
Changed Handling Ratings to ESD Ratings; moved storage temperature to Abs Max table ............................................... 4
Changed RθJA value from 36.6C/W to 33.3C/W; add additional thermal information ............................................................. 4
Added Community Resources section ................................................................................................................................ 51
Changes from Original (March 2013) to Revision A
Page
Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application
and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and
Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section ............. 1



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