LMV641MFSLASHNOPB datasheet(23/40 Pages) TI2

23 / 40 page

Rin

OUTPUT

Cbyp

GND

V+

INPUT

GND

LMV641

www.ti.com

SNOSAW3D – SEPTEMBER 2007 – REVISED AUGUST 2016

Product Folder Links: LMV641

Submit Documentation Feedback

9 Power Supply Recommendations

For proper operation, the power supplies must be properly decoupled. For decoupling the supply lines, TI

recommends that 10-nF capacitors be placed as close as possible to the op amp power supply pins. For single

supply, place a capacitor between V+ and V

− supply leads. For dual supplies, place one capacitor between V+

and ground, and one capacitor between V– and ground.

10 Layout

10.1 Layout Guidelines

To properly bypass the power supply, several locations on a printed circuit board need to be considered. A 6.8

µF or greater tantalum capacitor should be placed at the point where the power supply for the amplifier is

introduced onto the board. Another 0.1-µF ceramic capacitor should be placed as close as possible to the power

supply pin of the amplifier. If the amplifier is operated in a single power supply, only the V+ pin needs to be

bypassed with a 0.1-µF capacitor. If the amplifier is operated in a dual power supply, both V+ and V

− pins need

to be bypassed. It is good practice to use a ground plane on a printed-circuit board to provide all components

with a low-inductive ground connection.

10.2 Layout Example

Figure 47. LMV641 Layout Example

LMV641MF/NOPB bảng dữ liệu(PDF) 23 Page - Texas Instruments