A1

B1

C1

V

+

OUTPUT

SD

C3

SL

INVERTING INPUT

A3

B3

NON-

INVERTING

INPUT

A2

V

+

C2

V

-

LMC8101

SNOS496F – AUGUST 2000 – REVISED MARCH 2013

www.ti.com

Connection Diagrams

Figure 1. 8-Pin VSSOP Top View

Figure 2. DSBGA Top View

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

2KV(3)

ESD Tolerance

200V(4)

VIN differential

±Supply Voltage

Output Short Circuit Duration

See(5)(6)

Supply Voltage (V+

− V−)

12V

Voltage at Input/Output pins

V+ +0.8V, V−

−0.8V

Current at Input Pin

±10mA

Current at Output Pin(5)(6)

±80mA

Current at Power Supply pins

±80mA

Storage Temperature Range

−65°C to +150°C

Junction Temperature(7)

+150°C

Infrared or Convection (20 sec.)

235°C

Soldering Information

Wave Soldering (10 sec.)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not specified. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human body model, 1.5k

Ω in series with 100pF.

(4)

Machine Model, 0

Ω in series with 200pF.

(5)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature at 150°C. Output currents in excess of 40mA over long term may adversely affect

reliability.

(6)

Short circuit test is a momentary test. Output short circuit duration is infinite for VS < 6V. Otherwise, extended period output short circuit

may damage the device.

(7)

The maximum power dissipation is a function of TJ(MAX), θJA and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) − TA)/θJA. All numbers apply for packages soldered directly onto a PC board.

2

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