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LSF0108 bảng dữ liệu(PDF) 215 Page - Nexperia B.V. All rights reserved

tên linh kiện LSF0108
Giải thích chi tiết về linh kiện  Discrete and MOSFET components, analog & logic ICs
PDF  234 Pages
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nhà sản xuất  NEXPERIA [Nexperia B.V. All rights reserved]
Trang chủ  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

LSF0108 bảng dữ liệu(HTML) 215 Page - Nexperia B.V. All rights reserved

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DHVQFN20 (SOT764-1)
DHVQFN20 (SOT764-1)
SOT764-1
Footprint information for reflow soldering of DHVQFN20 package
Refer to the package outline drawing for actual layout
occupied area
solder land plus solder paste
solder land
solder paste deposit
0.400
0.650
0.025
4.800
5.750
0.500
0.290
1.700
2.900
3.500
5.500
0.900
1.700
3.700
3.750
2.800
0.105
0.025
SOT764-1
Footprint information for reflow soldering of DHVQFN20 package
Refer to the package outline drawing for actual layout
occupied area
solder land plus solder paste
solder land
solder paste deposit
0.400
0.650
0.025
4.800
5.750
0.500
0.290
1.700
2.900
3.500
5.500
0.900
1.700
3.700
3.750
2.800
0.105
0.025
14-12-12
Dimensions in mm
0.5
29
19
12
11
10
1
20
1.0
0.8
0.05
0.00
1.15
0.85
2.6
2.4
4.6
4.4
3.5
3.15
2.85
0.5
0.3
0.30
0.18
0.5
Minimized outline drawings and reflow soldering footprint
Dimensions in mm
20-pin SMD packages
24-pin SMD packages
TSSOP20 (SOT360-1)
TSSOP20 (SOT360-1)
SOT360-1
Footprint information for reflow soldering of TSSOP20 package
sot360-1_fr
Issue date 17-11-28
17-11-30
occupied area
solder paste deposit
solder land
solder land plus solder paste
recommended stencil thickness: 0.125 mm
1.35
5.30
7.45
0.60
0.3
0.5
0.125
4.50
1.25
7.20
0.65
0.75
0.40
0.125
6.90
7.30
SOT360-1
Footprint information for reflow soldering of TSSOP20 package
sot360-1_fr
Issue date 17-11-28
17-11-30
occupied area
solder paste deposit
solder land
solder land plus solder paste
recommended stencil thickness: 0.125 mm
1.35
5.30
7.45
0.60
0.3
0.5
0.125
4.50
1.25
7.20
0.65
0.75
0.40
0.125
6.90
7.30
SO24 (SOT137-1)
SO24 (SOT137-1)
SOT137-1
Footprint information for reflow soldering of SO24 package
sot137-1_fr
Issue date 17-11-28
17-11-30
occupied area
solder paste deposit
solder land
solder land plus solder paste
recommended stencil thickness: 0.15 mm
2.40
8.60
11.45
0.125
6.40
2.2
11.20
0.80
1.32
1.27
0.70
0.5
0.6
0.125
15.12
17.00
SOT137-1
Footprint information for reflow soldering of SO24 package
sot137-1_fr
Issue date 17-11-28
17-11-30
occupied area
solder paste deposit
solder land
solder land plus solder paste
recommended stencil thickness: 0.15 mm
2.40
8.60
11.45
0.125
6.40
2.2
11.20
0.80
1.32
1.27
0.70
0.5
0.6
0.125
15.12
17.00
15-05-26
Dimensions in mm
DHVQFN24 (SOT815-1)
DHVQFN24 (SOT815-1)
Images are for reference only, for detailed drawings please visit nexperia.com/packages



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