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LM2103DR bảng dữ liệu(PDF) 16 Page - Texas Instruments |
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LM2103DR bảng dữ liệu(HTML) 16 Page - Texas Instruments |
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16 / 29 page ![]() IGHL= VGVDD−VDH RGHL+RGATE+RGFET_INT (9) where • RGHL is the GH pulldown resistance The peak GL pullup current is shown in Equation 10. IGLH= VGVDD RGLH+RGATE+RGFET_INT (10) where • RGLH is the GL pullup resistance The peak GL pulldown current is shown in Equation 11. IGLL= VGVDD RGLL+RGATE+RGFET_INT (11) where • RGLL is the GL pulldown resistance For some scenarios, if the applications require fast turnoff, an anti-paralleled diode on RGate could be used to bypass the external gate drive resistor and speed up turnoff transition. 8.2.2.4 Estimate the Driver Power Loss The total driver IC power dissipation can be estimated through the following components. 1. Static power losses, PQC, due to quiescent currents IGVDD and IBST is shown in Equation 12. PQC = VGVDD × IGVDD + (VGVDD – VF) × IBST = 12V × 0.43mA + (12V – 1V) × 0.15mA = 6.8mW (12) 2. Level-shifter losses, PIBSTS, due high-side leakage current IBSTS is shown in Equation 13. PIBSTS = VBST × IBSTS × D = 72V × 0.033mA × 0.95 = 2.26mW (13) where • D is the high-side switch duty cycle 3. Dynamic losses, PQG1&2, due to the FETs gate charge QG as shown in Equation 14. PQG1&2=2×VGVDD×QG×fSW× RGD_R RGD_R+RGATE+RGFET_INT= 2×12V×17nC×50kHz× 5.25Ω 5.25Ω+4.7Ω+2.2Ω =8.8mW (14) where • QG = Total FETs gate charge • fSW = Switching frequency • RGD_R = Average value of pullup and pulldown resistor • RGATE = External gate drive resistor • RGFET_INT = Internal FETs gate resistor 4. Level-shifter dynamic losses, PLS, during high-side switching due to required level-shifter charge on each switching cycle. For this example it is assumed that value of parasitic charge QP is 2.5 nC, as shown in Equation 15. PLS = VBST × QP × fSW = 72V × 2.5nC × 50kHz = 9mW (15) LM2103 SNVSC62A – APRIL 2023 – REVISED AUGUST 2023 www.ti.com 16 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: LM2103 |
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