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EXAMPLE STENCIL DESIGN

8X (.061 )

[1.55]

8X (.024)

[0.6]

6X (.050 )

[1.27]

(.213)

[5.4]

8X (.055)

[1.4]

8X (.024)

[0.6]

6X (.050 )

[1.27]

(.217)

[5.5]

SOIC - 1.75 mm max height

D0008B

SOIC

4221445/B 04/2014

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

HV / ISOLATION OPTION

.162 [4.1] CLEARANCE / CREEPAGE

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.127 MM] THICK STENCIL

SCALE:6X

SYMM

SYMM

1

4

5

8

IPC-7351 NOMINAL

.150 [3.85] CLEARANCE / CREEPAGE

SYMM

SYMM

1

4

5

8