6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

7

V

IIK

Input clamp current(2)

VI < –0.5 V or VI > VCC +

0.5 V

±20

mA

IOK

Output clamp current(2)

VO < –0.5 V or VO > VCC +

0.5 V

±20

mA

IO

Continuous output current

VO > –0.5 V or VO < VCC +

0.5 V

±25

mA

Open drain output current

VO > –0.5 V

–25

mA

Continuous current through VCC or GND

±50

mA

TJ

Junction temperature(3)

Plastic package

150

°C

Hermetic package or die

175

°C

Maximum lead temperature (soldering 10s)

SOIC - lead tips only

300

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated

under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

(3)

Guaranteed by design.

6.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

4.5

5.5

V

VIH

High-level input voltage

VCC = 4.5 V to 5.5 V

2

V

VIL

Low-level input voltage

VCC = 4.5 V to 5.5 V

0.8

V

VI

Input voltage

0

VCC

V

VO

Output voltage

0

VCC

V

tt

Input transition time

VCC = 4.5 V

500

ns

VCC = 5.5 V

400

TA

Operating free-air temperature

–55

125

°C

6.3 Thermal Information

THERMAL METRIC(1)

CD74HCT03

UNIT

N (PDIP)

D (SOIC)

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

65.4

102.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

53.1

59.2

°C/W

RθJB

Junction-to-board thermal resistance

45.1

58.6

°C/W

ΨJT

Junction-to-top characterization parameter

32.7

20.3

°C/W

ΨJB

Junction-to-board characterization parameter

44.9

58.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

CD74HCT03, CD54HCT03

SCHS414 – JUNE 2020

www.ti.com

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