ADS5240

SBAS326E – JUNE 2004 – REVISED JANUARY 2009 ...................................................................................................................................................... www.ti.com

• Changed fourth paragraph of Reference Circuit Design in Theory of Operation. ............................................................... 18

• Changed Figure 16. ............................................................................................................................................................. 18

• Added last sentence to fifth paragraph of Reference Circuit Design in Theory of Operation.............................................. 18

• Added Table 1...................................................................................................................................................................... 18

• Changed Clocking section in Theory of Operation. ............................................................................................................. 18

• Changed LVDS Buffers section in Theory of Operation...................................................................................................... 19

• Changed Power-Down Mode section in Theory of Operation. ............................................................................................ 20

• Added Table 2...................................................................................................................................................................... 20

• Deleted Supply Sequence section in Theory of Operation.................................................................................................. 20

• Added Reset section in Theory of Operation....................................................................................................................... 20

• Changed third and fourth sentences of first paragraph of Layout of PCB with PowerPAD Thermally-Enhanced

Packages section in Theory of Operation............................................................................................................................ 20

• Added second paragraph to Layout of PCB with PowerPAD Thermally-Enhanced Packages section in Theory of

Operation. ............................................................................................................................................................................ 20

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