SN75468, SN75469

SLRS023E – DECEMBER 1976 – REVISED JANUARY 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCE

Collector-emitter voltage

100

V

VI

Input voltage(2)

30

V

Peak collector current

500

mA

IOK

Output clamp current

500

mA

Total emitter-terminal current

–2.5

A

TJ

Operating virtual junction temperature

150

°C

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the emitter/substrate terminal E, unless otherwise noted.

7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V(ESD)

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±500

all pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VI

0

5

V

VCC

0

100

V

TJ

Junction Temperature

–40

125

°C

7.4 Thermal Information

SN7546x

THERMAL METRIC(1)

D

UNIT

16 PINS

RθJA

Junction-to-ambient thermal resistance

73

RθJC(top)

Junction-to-case (top) thermal resistance

40.3

RθJB

Junction-to-board thermal resistance

38.9

°C/W

ψJT

Junction-to-top characterization parameter

10.9

ψJB

Junction-to-board characterization parameter

38.7

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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