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LM337L

SNVS780E – MAY 1998 – REVISED DECEMBER 2016

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Copyright © 1998–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 3

6.1

Absolute Maximum Ratings ...................................... 3

6.2

ESD Ratings.............................................................. 3

6.3

Recommended Operating Conditions ....................... 3

6.4

Thermal Information .................................................. 4

6.5

Electrical Characteristics........................................... 4

6.6

Typical Characteristics .............................................. 5

7

Detailed Description .............................................. 6

7.1

Overview ................................................................... 6

7.2

Functional Block Diagram ......................................... 6

7.3

Feature Description................................................... 6

7.4

Device Functional Modes.......................................... 6

8

Application and Implementation .......................... 8

8.1

Application Information.............................................. 8

8.2

Typical Applications .................................................. 8

9

Power Supply Recommendations ...................... 10

10

Layout................................................................... 10

10.1

Layout Guidelines ................................................. 10

10.2

Layout Example .................................................... 10

11

Device and Documentation Support ................. 11

11.1

Documentation Support ........................................ 11

11.2

Receiving Notification of Documentation Updates 11

11.3

Community Resources.......................................... 11

11.4

Trademarks ........................................................... 11

11.5

Electrostatic Discharge Caution ............................ 11

11.6

Glossary ................................................................ 11

12

Mechanical, Packaging, and Orderable

Information ........................................................... 11

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (May 2013) to Revision E

Page

•

Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings table,

Recommended Operating Conditions table, Typical Characteristics section, Detailed Description section, Application

and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation

Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1

•

Deleted DSBGA Package references throughout the data sheet .......................................................................................... 1

•

Deleted soldering information rows from Absolute Maximum Ratings table .......................................................................... 3

•

Added Thermal Information table ........................................................................................................................................... 4

•

Changed RθJA values for D (SOIC) package From: 180 To: 111.3 and for LP (TO-92) package From: 160 To: 156.9 ........ 4

Changes from Revision C (May 2013) to Revision D

Page

•

Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 1