6.7 Alternate Industry Standard Compatible Stencil Opening

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EXAMPLE STENCIL DESIGN

.000 PKG

0

29X (0.6)

29X (0.25)

24X (0.45)

4X (

)

2.245

4X (

)

1.375

4X (

)

1.175

4X (

)

0.305

3X (

)

0.13

3X (

)

1.05

3X (

)

1.25

4X (

)

2.17

(

)

2.6

(

) TYP

3.2

(

) TYP

2.75

(

)

0.375

(

)

0.25

(

)

0.025

(

)

0.12

(

)

0.38

(

)

0.84

(

)

1.05

10X (0.25)

9X (0.45)

(R0.05) TYP

VQFN-CLIP - 1.05 mm max height

RWJ0041A

PLASTIC QUAD FLATPACK - NO LEAD

4221590/D 04/2019

NOTES: (continued)

5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

PADS 7-9 & 20-24: 70%; PADS 25-29: 70%

PAD 40: 70%; PAD 41: 71%

SCALE: 20X

EXPOSED

METAL

METAL UNDER

SOLDER MASK

TYP

SOLDER MASK

OPENING

TYP

EXPOSED

METAL

EXPOSED

METAL

1

6

9

10

19

20

29

24

25

30

39

40

41

7

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CSD95430RRB

SLPS759 – JANUARY 2023

Copyright © 2023 Texas Instruments Incorporated

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