5 Specifications

5.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

7

V

IIK

Input diode current(2)

VI < –0.5 V or VI > VCC + 0.5 V

±20

mA

IOK

Output diode current(2)

VO < –0.5 V or VO > VCC + 0.5 V

±20

mA

IO

Output source or sink current per output pin

VO > –0.5 V or VO < VCC + 0.5 V

±25

mA

Continuous current through VCC or GND

±70

mA

TJ

Junction temperature

150

°C

Lead temperature (soldering 10s) (SOIC - lead tips only)

300

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated

under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

5.2 Recommended Operating Conditions

MIN

MAX

UNIT

VCC

Supply voltage range

HC types

2

6

V

HCT types

4.5

5.5

VI

Input voltage

0

VCC

V

VO

Output voltage

0

VCC

V

tt

Input rise and fall time

VCC = 2V

1000

ns

VCC = 4.5V

500

VCC = 6V

400

TA

Temperature range

-55

125

°C

5.3 Thermal Information

THERMAL METRIC

N (PDIP)

D (SOIC)

NS (SOP)

PW (TSSOP)

UNIT

16 PINS

16 PINS

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal

resistance

(1)

67

73

64

108

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report

CD54HC173, CD74HC173, CD54HCT173, CD74HCT173

SCHS158F – NOVEMBER 1998 – REVISED MARCH 2022

www.ti.com

4

Submit Document Feedback

Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: CD54HC173 CD74HC173 CD54HCT173 CD74HCT173