www.ti.com

EXAMPLE BOARD LAYOUT

0.05 MIN

TYP

(4.02)

6X (1.27)

(5.59)

8X (0.41)

4X (0.81)

(4.42)

(R0.05) TYP

(

0.2) VIA

TYP

(0.39) TYP

4X (1.34)

(0.715)

TYP

3X

(1.43)

4X

(1.245)

2X (1.19)

(2.39)

4X (0.81)

VSON-CLIP - 1.05 mm max height

DQH0008A

PLASTIC SMALL OUTLINE - NO LEAD

4223292/A 10/2016

PKG

1

4

5

8

SYMM

LAND PATTERN EXAMPLE

SOLDER MASK DEFINED

SCALE:15X

9

SOLDER MASK

OPENING

TYP

METAL UNDER

SOLDER MASK

TYP

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.