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TPS53014DGS bảng dữ liệu(PDF) 4 Page - Texas Instruments |
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TPS53014DGS bảng dữ liệu(HTML) 4 Page - Texas Instruments |
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4 / 25 page ![]() 4 TPS53014 SLVSBF1A – MAY 2012 – REVISED FEBRUARY 2019 www.ti.com Product Folder Links: TPS53014 Submit Documentation Feedback Copyright © 2012–2019, Texas Instruments Incorporated (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings Operating under free-air temperature range (unless otherwise noted) (1) VALUE UNIT Input voltage range VIN, EN –0.3 to 30 V VBST –0.3 to 36 VBST - SW –0.3 to 6 VFB –0.3 to 6 SW –0.3 to 30 SW (10 nsec transient) –3.0 to 30 Output voltage range DRVH –2 to 36 V DRVH - SW –0.3 to 6 DRVL, VREG5, SS –0.3 to 6 PGND –0.3 to 0.3 TA Operating ambient temperature range –40 to 85 °C TSTG Storage temperature range –55 to 150 °C TJ Junction temperature range –40 to 150 °C 6.2 Recommended Operating Conditions MIN MAX UNIT Supply input voltage range VIN 4.5 28 V Input voltage range VBST –0.1 33.5 V VBST - SW –0.1 5.5 VFB –0.1 5.5 EN –0.1 28 SW –1.0 28 Output Voltage range DRVH –1.0 33.5 V DRVH - SW –0.1 5.5 DRVL, VREG5, SS –0.1 5.5 PGND –0.1 0.1 TA Operating free-air temperature –40 85 °C TJ Operating junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953). 6.3 Thermal Information THERMAL METRIC(1) TPS53014 UNITS DGS (10 PINS) θJA Junction-to-ambient thermal resistance 172.2 °C/W θJCtop Junction-to-case (top) thermal resistance 44.0 °C/W θJB Junction-to-board thermal resistance 93.0 °C/W ψJT Junction-to-top characterization parameter 1.6 °C/W ψJB Junction-to-board characterization parameter 91.4 °C/W θJCbot Junction-to-case (bottom) thermal resistance n/a °C/W |
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