4

SN5414, SN54LS14, SN7414, SN74LS14

SDLS049C – DECEMBER 1983 – REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: SN5414 SN54LS14 SN7414 SN74LS14

Submit Documentation Feedback

Copyright © 1983–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Voltage values are with respect to network ground terminal.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, VCC

(2)

7

V

Input voltage

SNx414

5.5

V

SNx4LS14

7

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±2000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

SN5414, SN54LS14

4.5

5

5.5

V

SN7414, SN74LS14

4.75

5

5.25

IOH

High-level output current

SN5414, SN7414

–0.8

mA

SN54LS14, SN74LS14

–0.4

IOL

Low-level output current

SN5414, SN7414

16

mA

SN54LS14

4

SN74LS14

8

TA

Operating free-air temperature

SN5414, SN54LS14

–55

125

°C

SN7414, SN74LS14

0

70

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

The package termal impedance is calculated in accordance with JESD 51-7.

6.4 Thermal Information

THERMAL METRIC(1)

SNx414, SNx4LS14

UNIT

D (SOIC)

DB (SSOP)

N (PDIP)

NS (SO)

14 PINS

14 PINS

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance(2)

90.1

105.4

54.9

88.8

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

50.3

57.3

42.5

46.5

°C/W

RθJB

Junction-to-board thermal resistance

44.3

52.7

34.7

47.5

°C/W

ψJT

Junction-to-top characterization parameter

17.9

22.5

27.8

16.8

°C/W

ψJB

Junction-to-board characterization parameter

44.1

52.2

34.6

47.2

°C/W