Unless otherwise noted, V

values and limits appearing in normal type apply for T

ture range for operation, −40 to +125˚C. (Note 13)

Symbol

Parameter

Conditions

Typical

Limit

Units

Min

Max

DEVICE OUTPUT: 2.5

≤ V

OUT

≤ 3.3V

∆V

OUT

Output Voltage Tolerance

I

-2

2

%of

V

OUT(NOM)

−3

3

Line Regulation Error

V

I

−0.1

0.1

%/V

micro SMD

Load Regulation Error

I

0.0004

0.002

%/mA

LLP

Load Regulation Error

I

0.003

%/mA

Dropout Voltage

I

0.4

2

mV

I

60

100

PSRR

Power Supply Rejection Ratio

(Note 11)

f = 1 kHz, I

60

dB

f = 10 kHz, I

50

FULL V

I

LOAD

Load Current

(Notes 10, 11)

0

µA

I

Q

Quiescent Current

V

85

150

µA

V

140

200

V

0.003

1.5

I

SC

Short Circuit Current Limit

450

mA

E

N

Output Noise Voltage ((Note 11)) BW = 10 Hz to 100 kHz,

V

10

µVrms

BW = 10 Hz to 100 kHz,

V

30

T

SHUTDOWN

Thermal Shutdown

Temperature

160

˚C

Hysteresis

20

ENABLE CONTROL CHARACTERISTICS

I

EN

Maximum Input Current at

V

V

0.001

µA

V

IL

Low Input Threshold

0.4

V

V

IH

High Input Threshold

0.9

V

TIMING CHARACTERISTICS

T

ON

Turn On Time (Note 11)

To 95% Level (Note 12)

140

µs

Note 3: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device

is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical

Characteristics tables.

Note 4: All voltages are with respect to the potential at the GND pin.

Note 5: For further information on these packages please refer to the following application notes;

AN-1112 Micro SMD Package Wafer Level Chip Scale Package,

AN-1187. Leadless Leadframe Package.

Note 6: Internal Thermal shutdown circuitry protects the device from permanent damage.

Note 7: In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to be derated.

the junction to ambient thermal resistance in the application (

T

θ

Note 8: Junction to ambient thermal resistance is highly dependant on the application and board layout. In applications where high thermal dissipation is possible,

special care must be paid to thermal issues in the board design.

Note 9: The human body is 100 pF discharge through 1.5 k

Ω resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin.

Note 10: The device maintains the regulated output voltage without load.

Note 11: This electrical specification is guaranteed by design.

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