PACKAGE OPTION ADDENDUM

www.ti.com

23-May-2025

PACKAGING INFORMATION

Orderable part number

Status

(1)

Material type

(2)

Package | Pins

Package qty | Carrier

RoHS

(3)

Lead finish/

Ball material

(4)

MSL rating/

Peak reflow

(5)

Op temp (°C)

Part marking

(6)

TLC7701MDREP

Active

Production

SOIC (D) | 8

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

7701ME

TLC7701MDREP.A

Active

Production

SOIC (D) | 8

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

7701ME

TLC7701MPWREP

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

7701ME

TLC7701MPWREP.A

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

7701ME

TLC7701QPWREP

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 125

7701QE

TLC7701QPWREP.A

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

7701QE

TLC7705QPWREP

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 125

7705QE

TLC7705QPWREP.A

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

7705QE

TLC7733MPWREP

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

7733ME

TLC7733MPWREP.A

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

7733ME

TLC7733QPWREP

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 125

7733QE

TLC7733QPWREP.A

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

7733QE

V62/04604-01XE

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 125

7701QE

V62/04604-02XE

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 125

7705QE

V62/04604-03XE

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 125

7733QE

V62/04604-04YE

Active

Production

SOIC (D) | 8

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

7701ME

V62/04604-06XE

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

7733ME

(1) Status: For more details on status, see our product life cycle.

(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,

reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional

waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum

column width.

(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.

Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

Addendum-Page 1