7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage range(2)

–0.5

6.5

V

VI

Input voltage range(2) (3)

–0.5

6.5

V

VO

Switch I/O voltage range(2) (3) (4)

–0.5

VCC + 0.5

V

IIK

Control input clamp current

VI < 0

–50

mA

II/OK

I/O port diode current

VI/O < 0 or VI/O > VCC

–50

mA

IT

On-state switch current

VI/O = 0 to VCC

±50

mA

Continuous current through VCC or GND

±100

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to ground, unless otherwise specified.

(3)

Exceeding the input and output negative-voltage ratings is permitted when in observance of the input and output clamp-current ratings.

(4)

This limit on this value is limited 5.5 V maximum.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

2000

V

Charged-device model (CDM), per AEC Q100-011

750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Thermal Information

THERMAL METRIC(1)

SN74LVC2G66-Q1

UNIT

DCU (VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

204.4

°C/W

RθJCtop

Junction-to-case (top) thermal resistance

77

°C/W

RθJB

Junction-to-board thermal resistance

83.2

°C/W

ψJT

Junction-to-top characterization parameter

7.1

°C/W

ψJB

Junction-to-board characterization parameter

82.7

°C/W

RθJCbot

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Recommended Operating Conditions

See (1)

MIN

MAX

UNIT

VCC

Supply voltage

1.65

5.5

V

VI/O

I/O port voltage

0

VCC

V

VIH

High-level input voltage, control input

VCC = 1.65 V to 1.95 V

VCC × 0.65

V

VCC = 2.3 V to 2.7 V

VCC × 0.7

VCC = 3 V to 3.6 V

VCC × 0.7

VCC = 4.5 V to 5.5 V

VCC × 0.7

SN74LVC2G66-Q1

SCES829B – JUNE 2011 – REVISED OCTOBER 2021

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